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Android Development Board
US$56.90-60.60 / Piece
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What is Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2 Pieces US$56.90-60.60 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Rockchip
  • Maximum Memory Capacity 8G
  • Structure ATX
  • Memory DDR2
  • SATA Interface SATA3.0
  • CPU Socket LGA 775
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
  • Specification Customized
  • Trademark customized
  • Origin Shenzhen, China
  • Name PCBA Assembly Manufacturing
  • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
  • Advantages PCB Design/Assembly, PCBA & EMS
  • Good Services SMT, BGA and DIP
  • Production Type SMT & DIP & Assembling & Testing
  • Certificate UL94V-0+RoHS
  • Services OEM&ODM Manufacturer Since 2005
  • Item Control Board PCBA

Product Description

Product Description Rockchip RK3568 Quad-core Dual Screen Embedded Industrial Open Source Development Board System CPU Rockchip RK3568,ARM 4Core A55,UP to 2.0GHz GPU Mali-G52 2EE NPU Support 1Tops Computing power RAM With Standard 2GB/4GB/8GB LPDDR4 R0M With Standard ...

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Android Development Board Comparison
Transaction Info
Price US$56.90-60.60 / Piece US$80.00-350.00 / unit US$150.00-350.00 / unit US$80.00-300.00 / unit US$80.00-300.00 / unit
Min Order 2 Pieces 1 unit 1 unit 1 unit 1 unit
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification UL94V-0+RoHS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Europe, Southeast Asia/ Mideast, Australia, Domestic Europe, Southeast Asia/ Mideast, Australia, Domestic Europe, Southeast Asia/ Mideast, Australia, Domestic Europe, Southeast Asia/ Mideast, Australia, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Rockchip;
Maximum Memory Capacity: 8G;
Structure: ATX;
Memory: DDR2;
SATA Interface: SATA3.0;
CPU Socket: LGA 775;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Name: PCBA Assembly Manufacturing;
Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
Advantages: PCB Design/Assembly, PCBA & EMS;
Good Services: SMT, BGA and DIP;
Production Type: SMT & DIP & Assembling & Testing;
Services: OEM&ODM Manufacturer Since 2005;
Item: Control Board PCBA;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mio;
Memory: DDR4;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Micro ATX;
Memory: DDR4;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Memory Bank: 2DDR4DIMM;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 4G;
Structure: Mio;
Memory: DDR2;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 4G;
Structure: Mio;
Memory: DDR2;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
with CPU: Yes;
Chipset: Other;
Fsb/Ht: 2400;
Socket Typeo: Onboard CPU;
CPU Type: Intel;
Aunch Date: 2018;
Hard Drive Interface: SATA;
Item Condition: New;
Memory Channel: Double;
Products Status: New;
Private Mold: Yes;
Application: Server/Workstation;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier

Beijing Teket Innovation Technology Company Limited

Gold Member Audited Supplier