| Specification |
Metal Coating: Copper / Tin / Gold / Sliver;
Mode of Production: SMT&DIP;
Layers: Singer-Layer/Double-Layer/Multilayer(Max 64layers);
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01015;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi, Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C, B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C,B Value 3470K;50K/25°C;
Protection Function: Discharge Super Heat Temperature Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: One-Step PCB Service;
Solder Mask Color: Blue.Green.Red.Black.White;
Layer: 1-40layers;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: HASL\OSP\Immersion Gold;
HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
Copper Thickness: 0.5-5oz;
Board Thickness: 1.6 ±0.1mm;
Minimum Hole: Minimum;
Minimum Width: 3/3mil;
Minimum Line: 3/3mil;
Product Name: OEM PCB PCBA Board Assembly;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C, B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
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