| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
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Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Measurement Principle: Sine White Projection PMP Inspection;
Lens Resolution: 42mmx42mm (Based on 6. 5 M Pixel / 16.5um Resoluti;
Accuracy: Xy(Resolution):±1um;
Inspection Speed: 0.45 Sec/Fov;
Mark-Point Detection Time: 0.5sec/Piece;
Max.PCB Size: 510*460mm;
PCB Thickness: 0.3 ~ 6.0mm;
PCB Warpage: ±2.0mm;
PCB Weight: 4kg;
PCB Height: Top:50mm;
Conveyor Height: 900±20mm;
Conveyor Direction: L ~R or R ~L;
Power: AC220 50/60Hz,5A;
Compressed Air: 0.4 ~ 0.6MPa;
Weight: 1100kg;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
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