| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Grandtop;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Comformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Spacing: Standard;
Hole Spacing: 2.54mm;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: Double Sided Tin Spraying;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4high Tg Fr4,General Tg Fr4,Middle Tg Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Min.Line Width: 0.15mm;
Min.Hole Size: 0.1mm;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Layer: 1-24 Layers;
Copper Thickness: 0.5-6.0oz;
Board Thickness: 0.2-4.0mm;
Surface Finishing: HASL;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Spacing: Standard;
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
|
Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.15mm;
Hole Spacing: 2.54mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: Double Sided Tin Spraying;
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