| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, Aluminum, Cem-1, Rogers, High-Tg Fr-4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Customized;
Product Name: Custom PCB Board;
Keywords: Printed Circuit Board;
Layer Count: 1-32 Layers;
Board Thickness: 0.4mm - 3.2mm(Customized);
Copper Weight: Inner: 0.5oz - 3oz / Outer: 0.5oz - 6oz;
Min. Trace/Space: 3mil/3mil (0.075mm);
Min. Hole Size: 0.2mm(Customized);
Surface Finish: HASL Lead-Free, Enig, OSP, Immersion Silver, Hard;
Solder Mask / Silkscreen Color: Customized;
Special Process: Blind/Buried Vias, Impedance Control, Gold Fingers;
Testing: Flying Probe Test, E-Test, Aoi, X-ray Inspection;
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