| Specification |
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-2;
Customized: Customized;
Condition: New;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
PCB Factory: Yes;
Certificate Gurantee: Yes;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz/ 1oz;
Size: 56*46mm;
Min. Hole Size: 0.8 mm;
Min. Line Spacing: 10/10mil;
Min. Line Width: 10/10mil;
Function: Smart, Can Be Customized;
Type: PCM/BMS;
Samples: Available;
Board Size: Double-Sided Boards;
OEM and ODM: Welcome;
Application: Industy;
Board Thickness: 1.6mm;
Surface Finishing: Lead-Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Battery Pack: 10s;
Copper Thickness: 1oz/ 1oz;
Min. Hole Size: 0.8 mm;
Min. Line Spacing: 10/10mil;
Min. Line Width: 10/10mil;
Name: PCM;
Samples: Available;
OEM: Welcome;
Board Size: Double-Sided Boards/Multi-Layer;
OEM and ODM: Welcome;
Application: Electrical Tools;
Board Thickness: 1.6mm;
Surface Finishing: Lead-Free HASL;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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