| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Dimensions of Components: 01005 (Imperal)/0402 (Metric);
The Spacing of Components: The Minimum Spacing for IC Is 0.25mm, The Minimum;
The Minimum Spacing for IC Is 0.25mm, Th: up to 30mm;
Accuracy of The Patch: Chip: ±25μm, IC: Class ±30μm;
The Ability to Patch: 104300 Points/H;
PCBA Equipment: First Article Inspection;
Automated Optical Inspection: Solder Paste Inspection;
Automatic Screen Printer: Laser Marking Machine;
Laser Cutting Machine: Nitrogen Reflow Welding Furnace;
Available Components: Connector;
Active Components: Passive Components;
Discretes: Memory Chip;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Ability to Patch: 104300 Points/H;
PCBA Chip Processing: Massive Components in Stock;
High-Speed Bom Order: Selection & Optimization for Material;
Intelligent Counting of Materials: Intelligent Feeding;
Reserve Materials in Advance: Rapid Sampling;
SMT Panasonic High-Speed Patch Machine: DIP Welding & PCB Punching;
Aoi & Spi Detection: Aoi & Spi Detection;
Bulk Delivery Within 3-5 Days: Fast Logistics & Safety Acceptance;
Miniature Waterproof: Massive Component Inventory, Super Cost-Effective;
Wire Harness Processing: Customization of Design Scheme;
Components Selections: SMT Component Installation;
Contract for Labor and Materials of PCBA: Bom Order Allocation;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Ability to Patch: 104300 Points/H;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yuande;
Detection: Aoi & Spi Detection;
The Size of PCB: L50mm *W50mm-L510mm*W460mm;
The Thickness of PCB: 0.3mm~ 8mm;
The Ability to Patch: 104300 Points/H;
PCBA Chip Processing: Jingbei E-Shop;
Massive Components in Stock: High-Speed Bom Order;
Selection & Optimization for Material: Jingbei Warehouse;
Intelligent Counting of Materials: Intelligent Feeding;
Reserve Materials in Advance: Rapid Sampling;
SMT Panasonic High-Speed Patch Machine: DIP Welding & PCB Punching;
Aoi & Spi Detection: Real-Time Delivery;
24-Hour Delivery, Expedited 8h: 24-Hour Production Monitoring;
Bulk Delivery Within 3-5 Days: Fast Logistics & Safety Acceptance;
SMT Patch Manufacturing Capacity: The Size of PCB;
The Category of PCB: The Dimensions of Components;
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