| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Usage: Intelligent Locker, Vending Machine;
Selling Units: Single Item;
Warranty: 1year;
Color: Red and Black;
Service: Online Video Support;
Place of Origin: Guangdong,China;
MOQ: 5PCS;
Product Name: 2 Channel Lock Control Board;
Single Gross Weight: 0.500 Kg;
Private Mold: No;
Elivery Time: 7-15 Days;
Package: Carton;
Model Number: Upus+003;
Application: Industry Controller;
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Layers: Single-Layer;
Customized: Customized;
Condition: New;
Selling Units: Single Item;
Warranty: 1year;
Service: OEM Services Provided;
Product Type: PCBA;
Pplication: Smart Locker/Vending Machine System;
Product Name: 50 Channels Lock Control Board;
Brand Name: Upus;
Single Gross Weight: 0.300kg;
Voltage: 12V-24V;
Lace of Origin: Guangdong, China;
Private Mold: No;
Comuunication: RS485;
Package: Carton Box;
Model Number: Upus;
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Mode of Production: SMT/Thru-Hole;
Layers: 1 - 32layers;
Customized: Customized;
Condition: New;
Thickness: No Limit;
Order Volume: No Limit;
Layer Stackup: All Stack-up;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 201;
Minimum IC Pin Spacing: 0.35mm;
Minimum BGA Spacing: 0.35mm(Center to Center);
Reflow Temperature: 240+/-5 °C;
Spi: Yes;
Aoi: Yes;
Visual Inspection: Yes;
Build Time: 7-35 Days;
Function Test: Yes;
Conformal Coating: Yes;
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Mode of Production: SMT/Thru-Hole;
Layers: 1 - 32layers;
Customized: Customized;
Condition: New;
Thickness: No Limit;
Order Volume: No Limit;
Layer Stackup: All Stack-up;
Edge Rails: Necessary;
Fiducials: Necessary;
Minimum Package: 201;
Minimum IC Pin Spacing: 0.35mm;
Minimum BGA Spacing: 0.35mm(Center to Center);
Reflow Temperature: 240+/-5 °C;
Spi: Yes;
Aoi: Yes;
Visual Inspection: Yes;
Build Time: 7-35 Days;
Function Test: Yes;
Conformal Coating: Yes;
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