| Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: 14;
Base Material: Fr-4 Tg170;
Customized: Customized;
Condition: New;
Board Thickness: 0.2-6.0 mm;
Copper: 0.5-12 Oz;
Min Hole Size: 0.15 mm;
DIP Capacity: 100 Thousand Pins/Day;
Application: Communications, Industrial Control, Semiconductors;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min BGA Ball Pitch: 0.4mm;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-20 Layers;
Base Material: Kb;
Customized: Customized;
Condition: New;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.15-6mm;
Copper Thickness: 1-8 Oz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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