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Efficient Processing
US$0.70-6.00 / Piece
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What is Efficient PCBA Processing for High Quality OEM Circuit Boards

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.70-6.00 / Piece

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT+DIP
  • Layers 14
  • Base Material Fr-4 Tg170
  • Certification RoHS, CCC, ISO, IATF16949/UL/CQC
  • Customized Customized
  • Condition New
  • Transport Package Vacuum Packing, Blister, Plastic, Cartoon
  • Specification 5 x 5 MM-900 x 600 MM
  • Trademark Customized
  • Origin Guangdong, China
  • Board Thickness 0.2-6.0 mm
  • Copper 0.5-12 Oz
  • Min Hole Size 0.15 mm
  • DIP Capacity 100 Thousand Pins/Day
  • Application Communications, Industrial Control, Semiconductors
  • Service PCB+PCBA+Components+Reverse Engineer
  • Surface Finishing Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio
  • Min BGA Ball Pitch 0.4mm
  • Solder Resist Color Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU
  • PCBA-Testing Aoi,X-ray,Function Test
  • Delivery Time Within 3 Days(Sample)

Product Description

PCBA Process PCBA (Printed Circuit Board Assembly) is the core process in modern electronics manufacturing, encompassing the entire production chain from circuit design, PCB fabrication, component placement, soldering, testing, to final assembly. We provide high-precision, high-reliability PCBA ...

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Efficient Processing Comparison
Transaction Info
Price US$0.70-6.00 / Piece US$0.65-5.00 / Piece US$0.67-5.00 / Piece US$0.67-5.00 / Piece US$0.65-5.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, D/P T/T T/T T/T T/T
Quality Control
Product Certification RoHS, CCC, ISO, IATF16949/UL/CQC ISO RoHS, ISO RoHS, ISO ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: 14;
Base Material: Fr-4 Tg170;
Customized: Customized;
Condition: New;
Board Thickness: 0.2-6.0 mm;
Copper: 0.5-12 Oz;
Min Hole Size: 0.15 mm;
DIP Capacity: 100 Thousand Pins/Day;
Application: Communications, Industrial Control, Semiconductors;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min BGA Ball Pitch: 0.4mm;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Non-Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier