| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Metal Coating: /;
Mode of Production: SMT;
Layers: Double-Layer;
Customized: Customized;
Condition: New;
Power Supply: 24 V;
Product Type: Measurement and Control Board;
Digital Input: 8 Channels, Isolated;
Digital Output: 8 Channels, Isolated, High-Side Sourcing;
|
