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PCBA
US$5.00-30.00 / Piece
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What is Wind Power PCB Circuit Board Manufacturing Inverter PCBA for off-Grid Applications

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$30.00

1,000-2,999 Pieces US$10.00

3,000-4,999 Pieces US$7.00

5,000+ Pieces US$5.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application New Energy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Mu Star
  • Transport Package DHL, FedEx, UPS, EMS
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Product Name PCB Circuit Board PCBA
  • MOQ 1PCS
  • Layers 1-64 Layers
  • Board Thickness 0.4mm-10.0mm
  • Copper Thickness 1-10oz
  • Solder Mask Color White.Black.Yellow.Green.Red.Blue
  • Surface Finishing HASL(Lead-Free), Enig, Immersion Gold, Immersion T
  • Service PCB, Components, PCBA, SMT, DIP, Testing Service
  • Certificate ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD Wind Power PCB Circuit Board Manufacturing Inverter PCBA for Off-Grid Applications Product Description Our Advantage: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional ...

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PCBA Comparison
Transaction Info
Price US$5.00-30.00 / Piece US$0.10-2.20 / Piece US$1.02-5.00 / Piece US$0.01-0.05 / Piece US$0.68-1.98 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS ISO/CQC/IATF/UL/RoHS - - ISO9001/ISO14001/CE/RoHS
Management System Certification - - Others - Others
Trade Capacity
Export Markets Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM Own Brand, ODM, OEM - Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: New Energy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mu Star;
Product Name: PCB Circuit Board PCBA;
MOQ: 1PCS;
Layers: 1-64 Layers;
Board Thickness: 0.4mm-10.0mm;
Copper Thickness: 1-10oz;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Product Name: Fr4 Printed Circuit Board;
Layer: 1~20;
Finished Outer Copper Thickness: H/H0z-5/5oz;
Finished Inner Copper Thickness: H/H0z-4/4oz;
Min Board Size: 8*8mm;
Board Thickness: 0.3mm~3.5mm;
Max Board Size: 650*610mm;
Min Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver;
Value-Added Service: Layout;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jingxin;
Layer: 1-32;
Board Thickness: 0.2-8.0mm;
PCB Testing: Ict Testing and Flying Probe Testing;
PCBA Testing: Function Test, Aoi Test, X-ray Test, Software;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 & 3 Standard;
Thick Copper: 18um-210um(6oz);
Materials: Fr-4/Rogers/Cem1-3/Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, OSP etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
Certificates: ISO9001, IATF16949, ISO13485;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 4 Layers, 6 Layers, 8 Layers, Custom;
Legend: White;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jxpcba;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Supplier Name

Mu Star (Shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier