| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: High Complexity PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: SIC;
Customized: Customized;
Condition: New;
Board Thickness: 0.5-3 mm;
Copper Thickness: 0.5-8 Oz;
Material Type: Fr-4;
Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
Solder Mask Colors: Green/White/Blue/Black/Red;
Silk Screen Colors: White / Black;
Board Layer: 1-50 Layers;
Lead Time: 5-15 Days;
Service: OEM/ODM;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
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Metal Coating: Silver;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 4-50;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
MOQ: 1;
Layer: 1-50;
Lead-Time: 5-13;
Package: Vacuum Packaging;
Material: Fr4;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: High Complexity PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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