| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing & Inspection: Aoi/X-ray Inspection/Ict/Fct;
SMT Lines: 8 High-Speed SMT Lines;
Placement Speed: up to 120,000 Cph;
Solder Paste: Lead-Free (RoHS Compliant) / Leaded;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing & Inspection: Aoi/X-ray Inspection/Ict/Fct;
SMT Lines: 8 High-Speed SMT Lines;
Placement Speed: up to 120,000 Cph;
Solder Paste: Lead-Free (RoHS Compliant) / Leaded;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 1.5kw/1.8kw/2.8kw/3kw;
Rated Voltage: Single-Phase AC220V;
Heat-Dissipating Method: Air Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Substrate: Fr4, Cem1, Cem3;
PCB Layer Count: 1 Layer, 2 Layer, Multilayer PCB;
Copper: 1oz, 2oz, 3oz;
Soldermask: Green, Blue, White, Black, Red;
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