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Mustar Custom PCBA Manufacturer
US$0.90 / Piece
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What is Mustar Circuit Board Manufacturing PCB Assembly Circuit Board Other PCB & PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.90 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Medical Instruments
  • Flame Retardant Properties Other
  • Mechanical Rigid Other
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Other
  • Board Thickness 1.6mm
  • PCB Max Panel Size 1190*350mm/450*450mm

Product Description

Recommended by seller Product Paramenters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board Thickness 0.11-0.5mm Max.Copper Thickness 4OZ Layer ...

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Mustar Custom PCBA Manufacturer Comparison
Transaction Info
Price US$0.90 / Piece US$0.05-3.33 / Piece US$0.10-15.00 / Piece US$3.10-8.90 / Piece US$3.10-8.90 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Product Certification - - RoHS, UL CE, GS, ISO - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM - ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Supplier Name

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier