| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.6mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Legend: White;
Surface Finish: L-F HASL / Enig;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.6mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Legend: White;
Surface Finish: L-F HASL / Enig;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.6mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Legend: White;
Surface Finish: L-F HASL / Enig;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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