| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rck;
Service: One Stop Turnkey PCBA Service;
Test: 100%Test;
Condition: New;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
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Type: Rigid Circuit Board;
Dielectric: Ad1000;
Material: Woven Glass Reinforced PTFE/Ceramic Filled;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper, HASL, Enig, Immersion Silver,etc;
Base Material: Ad1000;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 6mil- 127mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Application: Low Noise Amplifiers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc;
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Type: Rigid Circuit Board;
Dielectric: RO4350b + Fr4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: Tp Material;
Material: Polyphenylene Ether, Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Tp Material;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Thickness: 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, etc.;
Layer Count: Single Sided, Double Sided PCB;
Application: Beidou, Missile-Borne Systems, Fuzes, and Antennas;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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