| Specification |
Metal Coating: Silver;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Application: Electrical & Electronics Industry;
Platform Number: 1;
Max Move Speed: Y :600-800mm/S. Z:400 mm/S. R :300°;
Solder Feeding Speed: 1~50mm/S;
Control Mode: Teach Pendant;
Max. PCB Size(mm): X500/Y300/Z100mm;
Solder Wire: 0.6~1.2mm Solder Wire;
Repeate Accuracy: +-0.02mm;
Temperature Range: 0-500℃;
Driving Mode: Step Motor;
Air Pressure: 4.5~6kg/Cm2;
Weight: Approx:65kg;
Power Supply: AC:220 +-10%,50/60Hz;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz or Custom;
Layer: 1-24;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz or Custom;
Layer: 1-24;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum/Pi;
Customized: Customized;
Condition: New;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum/Pi;
Customized: Customized;
Condition: New;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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