| Specification |
Metal Coating: Cast Iron (Surface Spray Paint Treatment);
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Application: Electrical & Electronics Industry, Lighting Indust;
Tin Furnace Material: Cast Iron;
Mode of Transport: Negotiable with Suppliers;
Warranty: 1 Year;
After-Sales Service: Online/Go to Client;
Customizable: Conditional Customization;
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Metal Coating: Gold;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA Service Mode: Full Turnkey, Kitted Assembl etc;
BGA Minimum Ball Pitch: 0.4mm, 0.5mm, 0.65mm, 0.8mm, >0.8mm;
Supported IC Packages: Qfn, Qfp, BGA, Micro-BGA, Sop, Soic, to-220;
Stencil Thickness: 0.1mm, 0.12mm, 0.15mm, Customized;
Aoi Optical Inspection: 100% Aoi Inspection, Spot-Check Aoi;
Ipc-a-610 Compliance: Ipc-a-610 Class 2, Ipc-a-610 Class3;
Application Field: Medical Device, Automotive, Power Supply, IoT;
Conformal Coating Thickness: 25-50μm, 50-75μm, Customer Specified Thickness;
MOQ: No MOQ;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Copper Thickness: 0.5-12 Oz, Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Special PCB Technology: Blind & Buried Vias; HDI; Flex PCB; Rigid-Flex etc;
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Metal Coating: Gold;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA Service Mode: Full Turnkey, Kitted Assembl etc;
BGA Minimum Ball Pitch: 0.4mm, 0.5mm, 0.65mm, 0.8mm, >0.8mm;
Supported IC Packages: Qfn, Qfp, BGA, Micro-BGA, Sop, Soic, to-220;
Stencil Thickness: 0.1mm, 0.12mm, 0.15mm, Customized;
Aoi Optical Inspection: 100% Aoi Inspection, Spot-Check Aoi;
Ipc-a-610 Compliance: Ipc-a-610 Class 2, Ipc-a-610 Class3;
Application Field: Medical Device, Automotive, Power Supply, IoT;
Conformal Coating Thickness: 25-50μm, 50-75μm, Customer Specified Thickness;
MOQ: No MOQ;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Copper Thickness: 0.5-12 Oz, Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Special PCB Technology: Blind & Buried Vias; HDI; Flex PCB; Rigid-Flex etc;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Product Category Entity: Printed Circuit Board Assembly (PCBA - Turnkey);
Assembly Capabilities: SMT, Tht, Mixed Assembly;
Component Placement Precision: ±0.035 mm (35μm) for 0201/BGA Components;
Fine Pitch Assembly: Down to 0.35 mm (BGA), 0.30 mm (Qfp);
Component Package Support: 01005, 0201, 0402, BGA, Csp, Qfn, Pop;
SMT Placement Capacity: 100, 000 Components/Hour (Combined SMT Lines);
Maximum Board Size: 510 mm X 460 mm;
Minimum Board Size: 50 mm X 50 mm;
Soldering Technology: RoHS Lead-Free Processing, Selective Soldering;
Ipc Inspection Standard -01: Ipc-a-610 Class 2 (Commercial);
Ipc Inspection Standard -02: Ipc-a-610 Class 3 (Medical/Defense);
Testing Capabilities: Aoi, 3D X-ray, in-Circuit Test, Functional Test;
OEM / ODM Custom: Accept;
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