| Specification |
Metal Coating: Cast Iron (Surface Spray Paint Treatment);
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
After-Sales Service Provided: Engineers Available to Service Machinery Overseas;
Application: Electrical & Electronics Industry, Lighting Indust;
Warranty: 1 Year;
Shipping Cost: Contact The Supplier About Freight and Estimated D;
Color: Grey;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Product Category Entity: Printed Circuit Board Assembly (PCBA - Turnkey);
Assembly Capabilities: SMT, Tht, Mixed Assembly;
Component Placement Precision: ±0.035 mm (35μm) for 0201/BGA Components;
Fine Pitch Assembly: Down to 0.35 mm (BGA), 0.30 mm (Qfp);
Component Package Support: 01005, 0201, 0402, BGA, Csp, Qfn, Pop;
SMT Placement Capacity: 100, 000 Components/Hour (Combined SMT Lines);
Maximum Board Size: 510 mm X 460 mm;
Minimum Board Size: 50 mm X 50 mm;
Soldering Technology: RoHS Lead-Free Processing, Selective Soldering;
Ipc Inspection Standard -01: Ipc-a-610 Class 2 (Commercial);
Ipc Inspection Standard -02: Ipc-a-610 Class 3 (Medical/Defense);
Testing Capabilities: Aoi, 3D X-ray, in-Circuit Test, Functional Test;
OEM / ODM Custom: Accept;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Product Category Entity: Printed Circuit Board Assembly (PCBA - Turnkey);
Assembly Capabilities: SMT, Tht, Mixed Assembly;
Component Placement Precision: ±0.035 mm (35μm) for 0201/BGA Components;
Fine Pitch Assembly: Down to 0.35 mm (BGA), 0.30 mm (Qfp);
Component Package Support: 01005, 0201, 0402, BGA, Csp, Qfn, Pop;
SMT Placement Capacity: 100, 000 Components/Hour (Combined SMT Lines);
Maximum Board Size: 510 mm X 460 mm;
Minimum Board Size: 50 mm X 50 mm;
Soldering Technology: RoHS Lead-Free Processing, Selective Soldering;
Ipc Inspection Standard -01: Ipc-a-610 Class 2 (Commercial);
Ipc Inspection Standard -02: Ipc-a-610 Class 3 (Medical/Defense);
Testing Capabilities: Aoi, 3D X-ray, in-Circuit Test, Functional Test;
OEM / ODM Custom: Accept;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Product Category Entity: Printed Circuit Board Assembly (PCBA - Turnkey);
Assembly Capabilities: SMT, Tht, Mixed Assembly;
Component Placement Precision: ±0.035 mm (35μm) for 0201/BGA Components;
Fine Pitch Assembly: Down to 0.35 mm (BGA), 0.30 mm (Qfp);
Component Package Support: 01005, 0201, 0402, BGA, Csp, Qfn, Pop;
SMT Placement Capacity: 100, 000 Components/Hour (Combined SMT Lines);
Maximum Board Size: 510 mm X 460 mm;
Minimum Board Size: 50 mm X 50 mm;
Soldering Technology: RoHS Lead-Free Processing, Selective Soldering;
Ipc Inspection Standard -01: Ipc-a-610 Class 2 (Commercial);
Ipc Inspection Standard -02: Ipc-a-610 Class 3 (Medical/Defense);
Testing Capabilities: Aoi, 3D X-ray, in-Circuit Test, Functional Test;
OEM / ODM Custom: Accept;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Color: Grey;
Package: 500g/Bottle;
Alloy: Sn45pb55;
Melting Point: 183℃;
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