| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
PCB Size: 50*50 ~ 500*500mm;
Conveying Method: Rail;
Control System: Touch Screen+PLC;
Heating Mode: IR(Hot Air Optional);
Conveyor Speed: 100~6000mm/Min;
Number of Heating Zones: Up4 / Bottom0;
Bottom Heating: Optional;
Length of Heating Zones: 2500mm;
Warming Time: Approx.10 Minute;
Power for Warm up: 10kw;
Power Consumption: 3kw;
Temperature Deviation: ± 5ºC;
Temperature Range: Room Temperature -100ºC;
Transport High: 920 ± 20mm;
Maximum PCBA Height: ± 110mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-1;
Customized: Customized;
Condition: New;
Keywords: Disinfector Device;
Product Name: Disinfector Device Controller Board;
Use Scene: Disinfector Device Control Board;
PCBA: PCBA Assembly;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Supplier Type: Manufacturer;
Type: Smart Electronics PCBA;
Solder Mask Color: Green, Yellow, Black, White, Red, Blue;
Sellina Iinite: Sinnle Item;
Profiling: Punchingrouting, V-Cutgolden Fingerbeveling;
Copper Thickness: 1oz or Custom;
Layer: 1-12;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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