| Specification |
Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
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Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4/Tg/Cem-1/Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
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