| Specification |
Type: LED Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4, Polyimide, Aluminum;
Insulation Materials: Organic Resin;
Board Type: Rigid, Flex, Rigid-Flex PCB;
Layer Count: 1 - 32 Layers;
Board Thickness: 0.2 mm - 3.2 mm;
Board Thickness Tolerance: ±10% (Min ±0.03 mm);
Finished Copper Weight: 0.5 Oz - 6.0 Oz (18-210 μm);
Min Line Width / Space: 0.05 mm / 0.05 mm (2 Mil);
Min Hole Size: 0.15 mm (6 Mil);
Surface Finish: Enig, HASL, OSP, Immersion Silver;
Solder Mask Color: Green, Blue, Black, White, Red;
Impedance Control: ±8% (50 ω, 100 ω Differential);
Operating Temperature Range: -40 °C to +130 °C;
Flammability Rating: UL 94V-0;
Dielectric Constant (Dk): 3.8 - 4.5 @ 1 GHz;
Testing Standard: 100% Aoi & Flying Probe Test;
Certifications: ISO 9001, IATF 16949, UL, RoHS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
|
Type: Rigid Circuit Board;
Dielectric: High Tg Fr-4 (Shengyi S1000h / Iteq It180A / 370hr;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yuwei;
Product Name: HDI PCB;
Keywords: HDI PCB for Medical Endoscope;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green, Red, Black, Blue, White, etc.;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.075mm;
Layer Count: 4-16L;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
|
