| Specification |
Type: LED Circuit Board;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Product Category Entity: Custom LED Printed Circuit Board;
Supported Board Types: Aluminum Core PCB, Copper Core PCB;
Supported Board Type: Thermoelectric Separation MCPCB, High-Tg Fr-4 LED;
Supported Layer Count: 1-4 Layer Metal Core & Hybrid Thermal Substrates;
Base Metal Core Material: Aluminum Alloy (5052 / 6061), High-Tg Fr-4;
Base Metal Core Materials: Oxygen-Free Copper (C1100);
Finished Board Thickness: 0.80 mm - 3.20 mm (±10%);
Base Copper Weight: 1.0 Oz - 6.0 Oz Heavy Copper Thermal Traces;
Min Line Width / Space: 0.075 mm / 0.075 mm (3 Mil / 3 Mil);
Min Drilling Hole Size: 0.20 mm (8 Mil) Mechanical / Laser Punching;
Solder Mask Options: High-Reflectivity Super White (>88%);
Surface Finish Options: HASL Lead-Free, Enig, OSP;
Breakdown Voltage (Dielectric): ≥ 3000V AC to 6000V AC High-Voltage Isolation;
Flammability Standard: UL 94V-0 Standard Compliant;
Acceptability Standard: Ipc-a-600 Class 2 & Ipc Class 3 (Automotive);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: OSP;
Solder Mask: Black;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Kb;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5 Days;
MOQ: 10PCS;
Delivery Time: 15 Days;
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