| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Product Category Entity: Printed Circuit Board Assembly (PCBA - Turnkey);
Assembly Capabilities: SMT, Tht, Mixed Assembly;
Component Placement Precision: ±0.035 mm (35μm) for 0201/BGA Components;
Fine Pitch Assembly: Down to 0.35 mm (BGA), 0.30 mm (Qfp);
Component Package Support: 01005, 0201, 0402, BGA, Csp, Qfn, Pop;
SMT Placement Capacity: 100, 000 Components/Hour (Combined SMT Lines);
Maximum Board Size: 510 mm X 460 mm;
Minimum Board Size: 50 mm X 50 mm;
Soldering Technology: RoHS Lead-Free Processing, Selective Soldering;
Ipc Inspection Standard -01: Ipc-a-610 Class 2 (Commercial);
Ipc Inspection Standard -02: Ipc-a-610 Class 3 (Medical/Defense);
Testing Capabilities: Aoi, 3D X-ray, in-Circuit Test, Functional Test;
OEM / ODM Custom: Accept;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Layer: 8 Layer;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Price: Negotiable (Depends on Your Gerber and Bom);
Packaging Details: PCB: Vacuum Packing/ PCBA: ESD Packing;
Supply Ability: Supply Ability;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Supporting Documents: Gerber File, Bom List, Schematic, Pick & Place Fil;
Packaging: Anti-Static Vacuum Bag, Tray Pack, Neutral Export;
Cooperation Mode: OEM Assembly, ODM Design, Reverse Engineering, PRO;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing,Flying Probe Tester,Functional;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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