| Specification |
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Product Category Entity: Custom Flexible Printed Circuit Board;
Supported Layer Count: 1-14 Layer Single/Double-Sided & Multilayer Flex;
Base Dielectric Material: Polyimide (Pi) Film, Polyester (Pet);
Finished Board Thickness: 0.05 mm - 0.40 mm (50 μm - 400 μm);
Base Copper Weight: 0.33 Oz - 2.0 Oz (12 μm - 70 μm);
Min Line Width / Space: 0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil);
Min Drilling Hole Size: 0.10 mm (4 Mil) Laser Via / Microvia;
Minimum Bend Radius: Sub-2.0 mm;
Stiffener Material Options: Stainless Steel, Fr-4, Polyimide (Pi), Aluminum;
Coverlay Film Options: Polyimide Film + Acrylic / Epoxy Adhesive;
Surface Finish Options: OSP, Immersion Silver, Selective Gold Plating;
Flammability Standard: UL 94V-0 Standard Compliant;
Quality Inspection Standard -01: 100% Aoi, Flying Probe E-Test;
Quality Inspection Standard -02: Dynamic Flex Fatigue Testing;
Acceptability Standard: Ipc-6013 Class 2 & Ipc-6013 Class 3;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min. Hole Size: 0.15mm;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075-0.9mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075-0.9mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Modelnumber: OEM FPC;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min. Hole Size: 0.15mm;
Board Size: Custom;
Min. Line Spacing: 0.075-0.9mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Min. Line Width: 0.075mm;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Plcopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Copper Thickness: 0.5oz;
Selling Units: Single Item;
Min.Hole Size: 0.15mm;
Packaging Details: Standard Package;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Item: Multilaver Flexible Printed Circuit Board;
Type: FPC;
Board Size: Custom;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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