| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Product Category Entity: Printed Circuit Board Assembly (PCBA - Turnkey);
Assembly Capabilities: SMT, Tht, Mixed Assembly;
Component Placement Precision: ±0.035 mm (35μm) for 0201/BGA Components;
Fine Pitch Assembly: Down to 0.35 mm (BGA), 0.30 mm (Qfp);
Component Package Support: 01005, 0201, 0402, BGA, Csp, Qfn, Pop;
SMT Placement Capacity: 100, 000 Components/Hour (Combined SMT Lines);
Maximum Board Size: 510 mm X 460 mm;
Minimum Board Size: 50 mm X 50 mm;
Soldering Technology: RoHS Lead-Free Processing, Selective Soldering;
Ipc Inspection Standard -01: Ipc-a-610 Class 2 (Commercial);
Ipc Inspection Standard -02: Ipc-a-610 Class 3 (Medical/Defense);
Testing Capabilities: Aoi, 3D X-ray, in-Circuit Test, Functional Test;
OEM / ODM Custom: Accept;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Aluminum;
Customized: Customized;
Condition: New;
Thickness: 1.5mm;
Copper Layer: 1oz;
Mask Color: White;
Surface Treatment: HASL, OSP, etc.;
Hole: Mechanical Hole, Laser Hole;
Mechanical Rigid: Rigid;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Dimensions: 100*130mm;
PCB Circuit: 16 Series, 48V DC;
Match LEDs: 16PCS CREE Xpg3 LEDs;
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Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
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Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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