| Specification |
Function Type: Thermal Imaging System;
Detection Type: Heat Detectors;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Metal;
Customized: Customized;
Detector: Hgcdte;
Resolution: 640*512 384*288 1280*1024;
Pixel Pitch: 12μm/17μm;
Size: ≤180mm×151.5mm×130mm;
Interface: SDI/Cameralink;
Operating Temperature: -40℃+70℃;
Cooling Mode: Sterling;
Power Consumption: 15-25W;
Input Voltage: DC 20-24V;
Netd: 22mk;
Spectral Range: 7.7μm-9.3μm;
F Number: 2.0;
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Function Type: Infrared Range and Communication System, Thermal Imaging System;
Detection Type: Heat Detectors;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Customized: Customized;
Resolution: 640 × 512;
Pixel Pitch: 15 μm;
F: F5.5;
Dimensions: 166 mm × 93 mm × 69 mm;
Weight: 900g;
Communication Interface: RS422 / RS232;
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IP Rating: IP67;
Customized: Customized;
Communication Method: RS458, 4-20mA, 0-5V, 0-10V, Single Bus;
Range: -20℃~400℃;
Accuracy: ±2℃/2% Reading;
Infrared Detector Resolution: 256*192;
Visible Light Resolution: 1920*1080;
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IP Rating: IP67;
Customized: Customized;
Communication Method: RS458, 4-20mA, 0-5V, 0-10V, Single Bus;
Range: -20℃~400℃;
Accuracy: ±2℃/2% Reading;
Infrared Detector Resolution: 256*192;
Visible Light Resolution: 1920*1080;
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Detection Type: Photon Detector;
Output Signal Type: Analog Type;
Production Process: Integration;
Material: Semiconductor Material;
IP Rating: No IP Grade;
Customized: Non-Customized;
Sensor Type: Ingaas;
Diameter of Photosensitive Surface (μm): 1000μm;
Response Band (μm): 1.0± 0.05~ 2.5± 0.05 Peak Wavelength ~ 2.2;
Dark Current @-0.5V(μa): 50;
Junction Resistance @-10mv(kΩ): 0.6;
Junction Capacitance @ Ov(PF): 1000;
Peak Response Rate (a/W): 1.1;
Package Form: To8;
Cooling Mode: Secondary Tec (Optional Uncooled);
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