| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Operating System: OEM;
PCB Testing: Flying Probe PCB Testing;
Applications: Industrial Equipment Board;
Design Philosophy: Customize;
Stocking Time: 3-5 Days;
Functional Application: Global Electronic Industry Application Fields;
Copper Thickness: 0.5oz~12oz(14.17g~340.19g);
Supplier Type: Original Manufacturer/OEM/EMS;
PCBA Service: SMT, DIP, One-Stop Turnkey PCBA Service;
Surface Finish: HASL, Enig, Immersion Ti, Immersion Silver, etc.;
Material: Fr-4/Fr1/Cem-1/Cem-3/Polyimild/PTFE/Rogersaluminum;
Color: Blue. Green. Red. Black;
Testing: 100% Aoi / X-ray / Ict/Aging Test/Functional Test;
Solder Type: Lead-Free - RoHS Compliant;
Stencils: Laser-Cut Stainless Steel Stencil;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Price: Negotiable (Depends on Your Gerber and Bom);
Packaging Details: PCB: Vacuum Packing/ PCBA: ESD Packing;
Supply Ability: Supply Ability;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Produuct Name: Heat Pump Control Board;
Application: Ice Bath Plunge Pool;
Power Supply: 110V or 220V±10%(AC), 50/60Hz;
Sensor Type: Ntc(5kΩ/25°C,B Value 3470K);
Measuring Range: -30°C~99°C;
Control Mode: Heating,Cooling, Auto;
|