| Specification |
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Industrial Control;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ke;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Customized Brand;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Inspection: Aoi Inspection;
External Cu Thickness: 0.5-10 Oz;
Internal Cu Thickness: 0.5-6 Oz;
Min. Track Width: 3 Mil;
Min. Track Space: 3 Mil;
Dielectric Thickness: 3mil-8mil;
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Structure: Customzied;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Customized Brand;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Inspection: Aoi Inspection;
External Cu Thickness: 0.5-10 Oz;
Internal Cu Thickness: 0.5-6 Oz;
Min. Track Width: 3 Mil;
Min. Track Space: 3 Mil;
Dielectric Thickness: 3mil-8mil;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Layers: Multilayers;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
|
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Layers: Multilayers;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
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