| Specification |
Type: PCB;
Dielectric: 1-32 Layers;
Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid / Flex / Rigid-Fle;
Processing Technology: HASL / Enig / OSP / Immersion Silver / Tin;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Green / Black / White / Red / Blue / Yellow;
Model: PCB;
Brand: Kq;
Application: Consumer Electronics / Industrial Control / IoT /;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL / Enig / OSP / Immersion Silver / Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Condition: New;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Layer Count: 2layer;
Board Thickness: 1.0mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Yellow;
Cooper Thickness: 1oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Layer Count: 2layer;
Board Thickness: 2.0mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Purple;
Cooper Thickness: 1oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Uc;
Layer Count: 6layers;
Board Thickness: 3.2mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Matte Green;
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