| Specification |
Type: PCB;
Dielectric: 1-32 Layers;
Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid / Flex / Rigid-Fle;
Processing Technology: HASL / Enig / OSP / Immersion Silver / Tin;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Green / Black / White / Red / Blue / Yellow;
Model: PCB;
Brand: Kq;
Application: Consumer Electronics / Industrial Control / IoT /;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL / Enig / OSP / Immersion Silver / Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Condition: New;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Conductor Material: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Flame Retardant Grade: V0;
- Edge Plating: Optional;
Impedance Control: Support;
Customized: Yes Custom Made;
Prototype Service: Yes;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
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