| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM PCB;
Product Name: Turnkey PCB Assembly Services;
PCBA Types: HDI PCBA, Rigid PCB, Rigid-Flex PCB, FPC;
Materials: Fr-4, Cem-1, Cem-3, Rogers, Al-Based Fr-4, Polyimi;
PCB Layer: 1-32 Layers;
Copper Thickness: 18um-210um(6oz);
Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
DIP Capacity: 100 Thousand Pins/Day;
PCB Material: High Quality Fr4, Rogers, and Aluminum Material;
Shipping: by DHL, FedEx, UPS;
Solder Resist Color: Green;Red;Yellow;Black;White;
Solder Mask Color: Yellow;Black;White;;
Delivery Time: Sample Is Available Within 3days;
Testing Service: 100% Aoi Lct Fct Testing;
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Type: Rigid Circuit Board;
Dielectric: High Tg Fr-4 (Shengyi S1000h / Iteq It180A / 370hr;
Material: Fiberglass Epoxy;
Application: Building Fire Safety System;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Keywords: Fire Alarm Control Panel PCB Board;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger, etc.;
Board Thickness: 0.6mm-6.5mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green, Red, Black, Blue, White, etc.;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.1mm;
Layer Count: 4-50L;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4, Tg, Cem-1, Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Copper Thickness Tolerance: +-0.250z;
Min Drill Hole Diameter: 0.010.1mm or 10 Mil;
Umber of Layers: 4-Layer;
Number of Layer: 1, 2, 4, 6, up To24 Layers;
Min Trace/Gap: 0.075mmor3 Mil;
Single Gross Weight: Kg;
Silk Screen: White, Black;
Board Size: 1200 mm*600mm Max;
Board Thickness: 0.2-4.0mm;
Silk Screen Min Line Width: 0.006or0.15mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Industrial Control;
Copper Foil Type: Electrolytic Copper Foil;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Conformal Coating: Optional;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Technical Service: Dfm Review, Technical Support;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Compliance Standard: Ipc a 610 Class 2 or Class 3;
Flame Retardant Grade: V0;
Number of Layers: 1 to 20 Layers;
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