| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM;
Materials: Fr4/ Al/ FPC/ Cem-1/ Cem-3/ 94V0/ Rogers;
PCB Layer: 1-32 Layers;
PCB Thickness: 1.6mm-3.2mm/ 0.2mm-1.2mm;
Copper: 18um-210um(6oz);
Surface Treatment: HASL/ Enig/ Lf-Hal/ Immersion T;
Gerber File Format: .PCB / .P-CAD / .Dx;
Solder Mask: Green/White/Black/Red/Purple/ Blue/Brown;
Sample L/T: 5 to 7work Days;
Standare: Ipc-160-2;
Certificates: ISO9001, ISO13485, IATF16949;
MOQ: 1;
Component Range: 01005, BGA, Flip Chips, Connectors;
Quality Control: Fly-Probe Testing,Aoi, X-ray, Ict Testing;
EMS Service: PCB Design, PCB Clone, PCB Layout, PCB Assembly;
PCBA Packaging: Bubble Bag, ESD, Vacuum Packing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Custom;
Dielectric: Custom;
Material: Custom;
Flame Retardant Properties: Custom;
Mechanical Rigid: Custom;
Processing Technology: Custom;
Base Material: Custom;
Insulation Materials: Custom;
Model: Custom;
Brand: Nova;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4, Cem1, Cem3 etc.;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb;
Copper: 1oz, 2oz, 3oz, 1/1oz, 2/2oz, 35/35um;
Surface Finish: OSP, HASL, HASL Lf, Enig;
Soldermask: Lpi;
Thickness: 1.6mm, 1.2mm, 1.0mm, 2.0mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4, Cem1, Cem3 etc.;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb;
Thickness: 1.6mm, 1.2mm, 1.0mm, 0.8mm;
Copper: 1oz, 2oz, 3oz, 35um, 70um;
Surface Finish: OSP, HASL, HASL Lf;
Soldermask: White, Black, Green, Blue, Yellow;
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