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Multilayer PCB
US$0.05-16.00 / Piece
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Programmable HDI PCB Prototype Boards for Advanced Electronics

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$16.00

10-99 Pieces US$9.00

100-999 Pieces US$0.90

1,000+ Pieces US$0.05

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Customer's Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 49 x 42 x 36 Centimeters/Piece
  • Trademark JXpcba
  • Origin China
  • Test Ict/ Fct
  • Certification ISO 9001/14001
  • Inner Packing Plastic
  • Outer Packing Carton

Product Description

About us Jingxin PCBA Electronic Technology Co.ltd Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the ...

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Multilayer PCB Comparison
Transaction Info
Price US$0.05-16.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.90-99.99 / PCS
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 PCS
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Product Certification ISO 9001/14001 - - - -
Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Ict/ Fct;
Inner Packing: Plastic;
Outer Packing: Carton;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: Tly-5;
Material: Woven Fiberglass Reinforcement;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Surface Finish: Immersion Gold;
Board Thickness: 0.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier