| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
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Type: Rigid Circuit Board;
Dielectric: F4btms1000;
Material: PTFE Ceramic Composite Dielectric Material;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: F4btms1000;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Application: Aerospace;
Thickness: 3.2mm;
Surface Finish: Immersion Gold;
Copper Weight: 2oz;
Layer Count: 2-Layer;
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Type: Rigid Circuit Board;
Dielectric: RO3203;
Material: Ceramic-Filled Laminates,Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper, HASL, Enig, Immersoin Silver,etc.;
Base Material: RO3203;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 60mil;
Layer Count: 2-Layer;
Dk: 3.02;
Copper Weight: 0.5, 1 or 2 Oz;
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Type: Rigid Circuit Board;
Dielectric: Rt/Duroid 5870;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz-6oz;
Surface Finishing: Lead Free HASL;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Layer: 2 Layer;
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