| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Component Packing: Tary, Tube, Tape;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
PCB Silkscreen Color: Black,White,Yellow;
Number of Layers: 1-32;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Service: One-Stop Turnkey;
Maximum Board Size: 640mm*1100mm;
Board Thickness: 0.2mm~6.0mm;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Structure: Double-Sided Rigid PCB;
Dielectric: RO3010;
Material: Ceramic-Filled PTFE Composite;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: HASL;
Production Process: Subtractive Process;
Base Material: RO3010;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: HASL;
Laminate Thickness: 0.7mm (Finished);
Layer Count: 2-Layer;
Copper Weight: 1 Oz (35 μm);
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Cu Base, High Tg Fr4, PTFE, Rogers;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Minimum Line: 0.075mm;
Minimum Space: 0.075mm;
Drilling Hole(Mechanical): 0.15mm--6.35mm;
Finish Hole(Mechanical): 0.10mm-6.30mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.15mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Soldermask: Green/White/Black/Yellow/Blue;
Silkscreen: Green/White/Black/Yellow/Blue;
Service: ODM, OEM;
Payment: T/T, Paypal, Western Union;
Testing Service: 100%;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
MOQ: 1PCS;
Soldermask: White, Black, Blue, Red Ect;
Silkcreen: White, Black, Blue, Red Ect;
File: PCB File;
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