| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Product Name: Turnkey PCB Assembly Services;
Quality Grade: Ipca610;
Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
DIP Capacity: 100 Thousand Pins/Day;
PCB Material: High Quality Fr4, Rogers, and Aluminum Material;
Shipping: by DHL, FedEx, UPS;
Solder Resist Color: Green;Red;Yellow;Black;White;
Solder Mask Color: Yellow;Black;White;;
Delivery Time: Sample Is Available Within 3days;
Testing Service: 100% Aoi Lct Fct Testing;
Design: Original;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Silkscreen: White, Black;
Number of Layers: 4-Layer;
Copper Thickness: 1oz;
Product Name: Single Layer PCB or 1-24 Layers PCB;
Min. Hole Size: 0.1mm;
Min. Line Spacing: 0.075mm;
Solder Mask Color: White Black Yellow Green Red Blue Orange Purple;
MOQ: 5PCS;
Min. Line Width: 0.15mm;
PCBA Service: Turnkey Assembly PCBA Service;
Components Sourcing: Yes;
Surace Treaunent: Hasllf HASL, Imm Goiamm Sver, USP etc;
Board Size: Custom;
Board Thickness: 1.6mm;
Surface Finishing: Custom;
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Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester,;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Thickness: 1.6mm;
Model Number: PCB;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz-5oz;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Service: One-Stop OEM Service;
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