| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM;
PCB Materials: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Fr;
Layer: 1, 2, 4, 6, up to 32 Layers;
PCB Type: Hard, Flexible, Rigid-Flexible;
PCB Shape: Any Shape: Rectangular, Round, Slots, Cutouts, COM;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 550mm*550mm LED PCBA Board: 500*1200mm;
Copper Thickness: 1/2oz, 1oz, 2oz, 3oz;
Surface Finish/Treatment: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
PCBA Packaging: Vacuum Packing, Plastic Bag, Standard Carton Packi;
Profiling Punching: Routing, V-Cut, Beveling;
Assembly Service: PCB Manufacturing, Components Sourcing and in-House;
Standard: PCBA Assembly with CE, 3c, RoHS, IATF16949 Approva;
OEM: PCBA, PCBA Aassembly: SMT & Pth & BGA;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
|
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
|
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
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Type: Rigid Circuit Board;
Dielectric: Tlx-0;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers/Taconic/Wangling;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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