| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: Jxpcba;
Brand: Customer's Brand;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Minimum Mechanical Drilling Aperture: 6mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Raw Material: FR4/Cem-1/Cem-3/FR1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue, Green, Red, Black, White., etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Conductor Material: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Flame Retardant Grade: V0;
- Edge Plating: Optional;
Impedance Control: Support;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Conductor Material: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Flame Retardant Grade: V0;
- Edge Plating: Optional;
Impedance Control: Support;
|
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Kb;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Conductor Material: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Flame Retardant Grade: V0;
- Edge Plating: Optional;
Impedance Control: Support;
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