| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Material: Fr-4, Cem-1, Cem-3, Aluminum, FPC, Rogers, Isola 3;
Layer: 1- 32 Layers;
Board Thickness: 0.3mm-4mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
PCB Standard: Ipc-a-610, Ipc-a-620;
Certificates: ISO9001, ISO14001, IATF 16949, ISO 13485;
Profiling Punching: Routing, V-Cut, Beveling;
OEM Services: PCBA, PCBA Aassembly: SMT & Pth & BGA;
ODM Services: PCB Design, PCB Layout, PCB Clone;
EMS Services: PCB Prototype, PCB Reverse Engineering;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Tes;
Other Services: Chip Programming & Function Test, Gluing, Conforma;
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Type: Rigid Laminate;
Dielectric: PTFE Microwave Substrate;
Material: Rogers RO4730g3;
Application: Modern Wireless Communication Infrastructure;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper,Electrodeposited Copper;
Base Material: Rogers RO4730g3;
Insulation Materials: PTFE;
Brand: Rogers;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Supplier: Manufacturer;
Layers: 1-50L;
Thicknees: 1oz/2oz;
Test: 100% Test;
Thickness: 1 Oz/2oz;
Lead Time: 6-15 Days;
Service: Fast-Prototype;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
Board Thickness: 0.5-3 mm;
Copper Thickness: 0.5-8 Oz;
Material Type: Fr-4;
Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
Solder Mask Colors: Green/White/Blue/Black/Red;
Silk Screen Colors: White / Black;
Board Layer: 1-50 Layers;
Lead Time: 5-15 Days;
Service: OEM/ODM;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
Board Thickness: 0.5-3 mm;
Copper Thickness: 0.5-8 Oz;
Material Type: Fr-4;
Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
Solder Mask Colors: Green/White/Blue/Black/Red;
Silk Screen Colors: White / Black;
Board Layer: 1-50 Layers;
Lead Time: 5-15 Days;
Service: OEM/ODM;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
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