| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Material: Fr-4, Cem-1, Cem-3, Aluminum, FPC, Rogers, Isola 3;
Layer: 1- 32 Layers;
Board Thickness: 0.3mm-4mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
PCB Standard: Ipc-a-610, Ipc-a-620;
Certificates: ISO9001, ISO14001, IATF 16949, ISO 13485;
Profiling Punching: Routing, V-Cut, Beveling;
OEM Services: PCBA, PCBA Aassembly: SMT & Pth & BGA;
ODM Services: PCB Design, PCB Layout, PCB Clone;
EMS Services: PCB Prototype, PCB Reverse Engineering;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Tes;
Other Services: Chip Programming & Function Test, Gluing, Conforma;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
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