| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
OEM & ODM: Conformal Coating, PCB Layout, PCB Clone;
PCB Material: Fr4, Cem1-Cem3, Rogers, Aluminum/Copper Based;
PCBA Layer: 1-32 Layers;
Copper Foil: 18um-210um(6oz);
Surface Finish: Enig/ HASL/Immersion Gold/OSP/ Golden Plated;
Certificates: ISO9001/IATF16949/ISO13485/CE/RoHS;
Solder Mask: Green;Red;Yellow;Black;White;
Test: X-ray, Aoi, in-Circuit Test(Ict), Functional Test;
OEM: SMT&DIP&Pth&BGA Assembly;
PCB Service: PCB Assembly, PCB/PCBA Design, PCBA Copy;
Components Range: Qfn, BGA, 0402, 0603, 0805, 1206, 1608, 2125;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
RoHS: RoHS/Lead Free Compliance;
EMS Service: Chip Programming & Function Test, Box Build Assemb;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: LED;
Brand: Xjy;
Copper Thickness: 1oz;
Surface Finishing: Hal;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 0.2~2mm;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.08mm;
Min. Line Width: 0.08mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Xjy;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.3mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Surface Finishing: OSP;
Copper Thickness: 35um;
Board Thickness: 1.6mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Soldermask: White, Green;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Board Thickness: 1.6mm;
Surface Finishing: Immersion Gold;
Copper Thickness: 1oz;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|