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Custom Design Boards
US$3.00-10.00 / Piece
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What is Multi-Layer PCBA Electronic Boards with Custom Design Solutions Offered

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-9 Pieces US$10.00

10+ Pieces US$3.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Customized
  • Transport Package Inner Vacuum Packing, Outer Carton
  • Specification Customized
  • Origin Shanghai, China
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable
  • Layer 1-32
  • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
  • Max Production Size 600*800mm

Product Description

Product Description Product Name Custom pcba &Original IC Electronic components Brand Name PCBA Base Material FR1~FR4/Aluminum/PI/CU Board Thickness according to customer`s requirements , 0.4mm-3.2mm Layer according to customer`s requirements , 1~58Layers Certificate ISO9001 ...

Learn More

Custom Design Boards Comparison
Transaction Info
Price US$3.00-10.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece
Min Order 5 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
Payment Terms LC, T/T, PayPal LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union
Quality Control
Product Certification - RoHS RoHS RoHS RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model - OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: PCB Layer 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Supplier Name

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier