| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4, Cem1, Cem3 etc.;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Jt;
Thickness: 1.6mm, 1.2mm, 1.0mm, 0.8mm;
Copper: 1oz, 2oz, 3oz, 35um, 70um;
Surface Finish: OSP, HASL, HASL Lf;
Soldermask: White, Black, Green, Blue, Yellow;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Fastline;
Board Material: Aluminum;
Board Thickness: 1.5mm;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: HASL Lead Free;
Lead Time: 5-7 Working Days, 6-8 Days;
Small Order: Accepted;
PCB Type: Aluminum LED PCB Board;
Supplier: Manufacturer;
SMT Lines: 12 Lines;
Thickness: 1 Oz/2oz/3oz/8oz;
Finish: Enig/Siover/Golden;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminium Base PCB;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 Mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 Mm;
Min Line Width&Space: 0.15 Mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminium Base PCB;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 0.8 Mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 Mm;
Min Line Width&Space: 0.15 Mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminium Base PCB;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 0.8 Mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 Mm;
Min Line Width&Space: 0.15 Mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
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