| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4, Cem1, Cem3 etc.;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb;
Thickness: 1.6mm, 1.2mm, 1.0mm, 0.8mm;
Copper: 1oz, 2oz, 3oz, 35um, 70um;
Surface Finish: OSP, HASL, HASL Lf;
Soldermask: White, Black, Green, Blue, Yellow;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carton;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carton;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Test: Aoi/Spi/X-ray;
Packing: Carton/ Vacuum/ Plastic;
Delivery Sample: 7-15 Days Sample;
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