| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Custom;
Mode of Production: Custom;
Layers: Custom;
Base Material: Custom;
Customized: Customized;
Condition: New;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing & Inspection: Aoi/X-ray Inspection/Ict/Fct;
SMT Lines: 8 High-Speed SMT Lines;
Placement Speed: up to 120,000 Cph;
Solder Paste: Lead-Free (RoHS Compliant) / Leaded;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing & Inspection: Aoi/X-ray Inspection/Ict/Fct;
SMT Lines: 8 High-Speed SMT Lines;
Placement Speed: up to 120,000 Cph;
Solder Paste: Lead-Free (RoHS Compliant) / Leaded;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing & Inspection: Aoi/X-ray Inspection/Ict/Fct;
SMT Lines: 8 High-Speed SMT Lines;
Placement Speed: up to 120,000 Cph;
Solder Paste: Lead-Free (RoHS Compliant) / Leaded;
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