| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
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Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
Dielectric: Fr-3, FR-4;
Material: Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate;
Application: Computer, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process, Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Board Material: Fr4;
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Structure: Fr4, Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Polyester Glass Fiber Mat Laminate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Conductive Adhesive: Conductive Silver Paste;
Combination Mode: SMT&DIP;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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