| Specification |
Metal Coating: Gold;
Mode of Production: SMT & DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA Service Mode: Full Turnkey, Kitted Assembl etc;
BGA Minimum Ball Pitch: 0.4mm, 0.5mm, 0.65mm, 0.8mm, >0.8mm;
Supported IC Packages: Qfn, Qfp, BGA, Micro-BGA, Sop, Soic, to-220;
Stencil Thickness: 0.1mm, 0.12mm, 0.15mm, Customized;
Aoi Optical Inspection: 100% Aoi Inspection, Spot-Check Aoi;
Ipc-a-610 Compliance: Ipc-a-610 Class 2, Ipc-a-610 Class3;
Application Field: Medical Device, Automotive, Power Supply, IoT;
Conformal Coating Thickness: 25-50μm, 50-75μm, Customer Specified Thickness;
MOQ: No MOQ;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Copper Thickness: 0.5-12 Oz, Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Special PCB Technology: Blind & Buried Vias; HDI; Flex PCB; Rigid-Flex etc;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4;
Surface Finish: HASL;
Printing Ink: Green;
Silk-Screen: White;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-20 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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