| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Tg Value: 130℃, 150℃, 170℃, 180℃;
Aoi Inspection: 100% Aoi, Spot Check;
Assembly Service Type: SMT Only, DIP Only, SMT+DIP Mixed;
MOQ: No MOQ;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White;
Application Industries: Communications, Industrial Control, Semiconductors;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flex PCB;
Copper Thickness: 0.5-12 Oz, Customized;
Surface Finishing: HASL, HASL Lf, OSP, Enig, Enepig, Immersion Silver;
Ipc Quality Class: Ipc-a-610 Class 1, Class 2, Class3;
BGA Minimum Pitch: 0.35mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm;
E-Test Coverage: 100% Electrical Test, Partial Test;
Hole Type: Pth, Npth, Blind Via, Buried Via, Microvia;
Warpage Specification: ≤0.5%, ≤1.0%, ≤1.5%;
Board Thickness: 0.2-6.0 mm, Customized;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control / Industrial Equipment / Electr;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: SMT;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Layer: 2 Layers / Customized;
Service: PCB Fabrication + PCBA Assembly;
Assembly Type: SMT, DIP, Mixed Assembly;
Surface Finish: HASL Lead Free / Enig / OSP;
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